What is the purpose of using lead-free low temperature solder paste SnBi and SnBiAg for SMT soldering? (0)

The design steps and application examples of PLC control system (0)

The first step of control system design is to determine the control object and control range. Because of this, we can know the functions that the PLC control system should have, and then choose a suitable PLC model.

How to accurately place 0201 components？ (0)

This article introduces that smaller components and narrower pitches pose new challenges for circuit board assembly. Understanding these placement issues can enable products to be introduced to the market faster and reduce defects.

Do you know what QC, IQC, IPQC, QA are? (0)

QC: Quality Control, the general term for quality control, product quality inspection, analysis, improvement and non-conforming product control related personnel after quality problems are found.

SMT Printer (Solder Paste Printing Machine) Operation Reasons and Inspection Introduction (0)

Solder paste printing is the first process of the SMT process, and it is a key process to ensure the quality of SMT. It directly affects the soldering quality and reliability of the surface assembly.

2D X-Ray technology applied to SMT inspection SMT BGA solder ball air solderingOpen (0)

In November 1895, the German physicist W.C. Roentgen discovered X-rays by chance. One day he was doing an experiment on cathode rays. He wrapped the discharge tube in black paper and turned it on. At this time, he found that the paper coated with fluorescent substances nearby gave off a fuzzy light.

How does SMT mounter detect and sense? (0)

There are sensors with different functions in the relevant parts of the machine to ensure the realization of machine motion coordination and function. A sensor is a device or device that can sense a specified object and convert it into a usable signal according to a certain rule.

SMT micro-pad leakage, less tin improvement and sharing (0)

As electronic products become lighter, thinner, and smaller, component solder terminals and PCB pads are getting smaller and smaller, which brings great challenges to solder paste printing. It is well known that the quality of solder paste printing is the core of SMT process control, and the quality of solder paste printing affects 60-70% of SMT quality problems.

How to control the placement quality of SMT pick and place machine (0)

In order to effectively ensure the placement quality, users should understand the various factors that affect the placement quality, and then control these influencing factors, so as to achieve the purpose of ensuring the placement quality. The main factors that affect the placement quality will be introduced below, and an effective placement quality control plan can be formulated based on these factors.

Investigation and improvement of black pads for immersion gold welding with nickel (0)

For multi-layer boards assembled with various precision components, in order to flatten the soldering pads and improve solderability, the strength of the solder joints and subsequent reliability are more certain.