SIPLACE TX

Faster, smaller, more advanced – the new high-end placement solution

The latest generation of our placement modules sets new records in speed, floorspace performance and accuracy for high-volume production applications. And for the first time, 0201 (metric) components can be placed at the highest speed.

SIPLACE TX highlights:

• NEW: SIPLACE SpeedStar with up to 48,000 cph and maximum component size of 8.2 mm x 8.2 mm x 4 mm with a placement accuracy of up to 25 µm/3 sigma
• SIPLACE MultiStar: Up to 25,500 cph
• SIPLACE TwinStar: The head for special tasks
• SIPLACE JEDEC Tray Feeder with up to 18 JEDEC trays
• SIPLACE TX micron: Placement accuracy of up to 15 µm @ 3 sigma
• More flexibility and performance through the combination of SIPLACE SpeedStar and SIPLACE MultiStar heads in a single placement area
• Placement force down to 0.5 N for sensitive components
• Touchless placement: Maximum placement quality for highly sensitive components
• NEW: SIPLACE Smart Pin Support: Automated pin mounting for printed circuit boards
• NEW: Maximum PCB size 550 mm x 460 mm